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Monday, September 07, 2015

Call For Entries: TiE International Business Plan Competition

The TiE International Start-Up Competition is now accepting applications for the 2015/16 competition at http://tieuknorth2016.istart.org/ this is a chance for businesses to compete in one of the world’s largest business competitions, with millions of dollars in prize money available.  In 2015, a TiE team (BetaGlide) won over $1 million, and had a life-changing experience meeting many of the world’s top investors in the USA at the competition.

NOTE: Applications are due by October 18 2015.


The competition is split into two distinct tracks:


1. RICE Track (for student/university businesses)

This track leads to the world’s richest business plan competition at RICE University in Houston, Texas. Winners of the TiE Rice Track will have automatic entry into the finals of this competition, where over $1.5m of prize money is issued.  TiE will also cover flights, hotels meals, engage the teams in a 3 day bootcamp hosted by some of the world’s top entrepreneurs, and also give $1000 spending money per company.

 

2. Investor Track:

The Investor Track, is open to all and will lead the teams to the World’s Largest Entrepreneurial Conference, TiEcon for the Global Finals. TiEcon is TiE’s flagship event which takes place in Silicon Valley each May. Applicants of this track will undergo intense mentoring prior to arriving and will be put in front of numerous investors and receive real time feedback from the experts in Silicon Valley. The winning teams will be given a booth on the expo floor of TiEcon to pitch their companies real time in front of over 5,000 TiEcon attendees

 

This is a fantastic opportunity for start-up businesses to win serious amounts of money, meet top international investors, and raise their profile in one of the most prestigious business plan competitions in the world.


Applications should be made at: http://tieuknorth2016.istart.org/


More information on the competition, and about previous winners can be found at: http://tisc.tie.org/

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